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Intel patents RGB MicroLED dies embedded in glass and wired through glass vias
Intel has won a U.S. patent for RGB MicroLED dies embedded in glass and wired through through-glass vias, aimed at diagnostics and chip lighting. Tom's Hardware sees a possible second route to co-packaged optics beside AUO's 10-metre MicroLED links, though the patent claims no optical interconnect.
Publishers:tomshardware.com
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