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Semiconductor manufacturing and packaging

The process of fabricating and packaging chips, spanning foundry nodes, fabs, and the capital and supply-chain systems behind chip production.

Current stories

investOne report1 publisher

GlobalFoundries ties its 1.1 billion euro Dresden expansion to a 7nm-class FD-SOI process for edge AI

GlobalFoundries plans to make a 7nm-class FD-SOI platform for edge AI chips in Dresden from 2028, alongside a 1.1 billion euro fab expansion. Crypto Briefing's report does not split the new capacity by process, so the company's estimate of a market above $18 billion by 2030 cannot yet be tied to wafers.

Reality

Evidence35
Adoption20
Hype gap+30
Incentives60
Confidence40
leadershipOne report1 publisher

Hobbs opens Taiwan's 14th US office in Phoenix over two written objections from China's consulate

Arizona Gov. Katie Hobbs opened Taiwan's 14th US office in Phoenix after two letters from China's consulate asked her to object. Chip suppliers weighing the state now have a host government publicly on Taiwan's side, and Beijing has answered so far only in writing.

Publishers:abcnews.comfortune.com

Reality

Evidence55
Adoption
Insufficient
Hype gap+10
Incentives60
Confidence60