build1 distinct publisher
Intel skipped Foveros on Wildcat Lake because the open link was the cheaper part
At Hot Chips 2026 Intel said an open die-to-die link, not advanced packaging, is what made its entry-level 18A chip possible. The bill came to 70% more interconnect area.
Publishers:tomshardware.com
Reality
- Evidence58
- Adoption28
- Hype gap+12
- Incentives72