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Moving the memory controller into the HBM base die buys back 5 to 10% of an accelerator die
Samsung told Hot Chips 2026 it intends to hollow out the accelerator by relocating its non-compute blocks into a 4nm HBM base die. The stated endpoint of that plan is a memory stack with no interposer under it.
Publishers:tomshardware.com
Reality
- Evidence44
- Adoption16
- Hype gap+29
- Incentives71