product1 distinct publisher
BAE clears Phase 1 of DARPA's THREADS, and the GaN power ceiling now looks thermal
A roughly fivefold gain in RF power density came from heat removal, not new device physics. DARPA still wants an eightfold cut in thermal resistance inside the transistor.
Publishers:interestingengineering.com
Reality
- Evidence48
- Adoption22
- Hype gap+14
- Incentives68
- Confidence45